Electronic devices and materials

Inside the AI Hardware Engine – Full Semiconductor Supply Chain Course

A New Era of Semiconductor Electronics – Part 1

Lec 33: Bistable Nematic Displays

This Could End The RAM Crisis

Lec 35: Bistable Cholesteric Reflective Displays and Drive Schemes (Part-2)

Lec 34: Bistable Cholesteric Reflective Displays and Drive Schemes (Part-1)

Lec 32: Bistable Ferroelectric LCDs and Drive Scheme

Lec 31: Active Matrix Displays

Lec 30: LCD Matrices & Drive Schemes-II

Lec 29: LCD Matrices & Drive Schemes-I

Lec 28: Phase Retardation LCDs & Cell-Gap Design

Lec 27: Classification of Transflective LCDs (Part-B)

Lec 27: Classification of Transflective LCDs (Part-A)

Lec 25: Introduction to Reflective LCDs

Lec 24: Multi - Domain VA & OBC Mode

Lec 23: Vertical Alignment Mode: Dynamics & Overdrive

Lec 22: In - Plane switching Mode

Lec 21: Transmissive Liquid Crystal Displays

China Just Built What ASML Feared Most

The 1-Nanometer Barrier Just Fell

Josephson Junction and Superconducting Quantum Circuit Fabrication Process

#55: CHASSIS - Europäische Chiplet-Initiative, Emissionen in der Halbleiterproduktion, ALLOS Semi...

#55: CHASSIS - European Chiplet Initiative, Emissions in Semiconductor Production, ALLOS Semi...

#43: Neue Halbleiterkrise? Nexperia Updates; Brains on Silicon - Review; Neue Chips: Europa von A...

#43: New Semiconductor Crisis? Nexperia Updates; Brains on Silicon - Review; New Chips: Europe from A...

Silicon Is Over. Meet Its Successor

The Thermodynamic AI Chip · Thomas Ahle

The Lab That Decides Which Chip Technologies the World Actually Builds

China Just Built What TSMC Said Was Impossible

They Just Shrunk AI Data Center by 10,000x

BJT Part2: Base width modulation, High Level Injection, Breakdown, Circuit Models | 2026 L13

Advanced CMOS Scaling: FinFET to GAA and CFET | 2026 L14

BJT Part1: NPN Operation, Minority Carrier Distribution & What Controls Current Gain | 2026 L12

Tearing Apart An X-Ray Machine - Nuclear Engineer Reacts to NileRed

MOSFET Part 2: Basic Operations and Key Advanced Concepts| 2026 L11

Cette nouvelle technologie pourrait tuer TSMC et ASML.

This new technology could kill TSMC and ASML.

The Terrifying Truth About TSMC's New Chips

MOSFET Part 1: Band Diagrams, Threshold Voltage, C–V | 2026 L10

Diode Current, Contacts & the Road to MOSFET: PN Current, Ohmic vs Schottky & MOS Capacitor | 2026L9

The Breakthrough Terrifying ASML

System-in-Package Challenges

Next Step in Semiconductor at Purdue